Novel TSV repair framework for 3D ICs

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dc.contributor.authorMurmu, Rajiv
dc.date.accessioned2025-06-04T05:58:43Z
dc.date.available2025-06-04T05:58:43Z
dc.date.issued2025-05
dc.identifier.urihttp://hdl.handle.net/123456789/4412
dc.language.isoenen_US
dc.publisherIndian Institute of Technology (Indian School of Mines) Dhanbaden_US
dc.subject3D ICsen_US
dc.subjectTSV griden_US
dc.subjectFlow based algorithmen_US
dc.subjectDISTen_US
dc.subjectDS1882en_US
dc.subjectCSEen_US
dc.titleNovel TSV repair framework for 3D ICsen_US
dc.typeThesisen_US
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