Electrical and electrothermal performance modeling and analysis of carbon-based nanoscale interconnects
| dc.contributor.author | Kumari, Bhawana | |
| dc.date.accessioned | 2022-11-01T09:16:51Z | |
| dc.date.available | 2022-11-01T09:16:51Z | |
| dc.date.issued | 2022-10 | |
| dc.identifier.uri | http://hdl.handle.net/123456789/2551 | |
| dc.language.iso | en | en_US |
| dc.publisher | Indian Institute of Technology (Indian School of Mines) Dhanbad | en_US |
| dc.subject | VLSI interconnects | en_US |
| dc.subject | MLGNR interconnect | en_US |
| dc.subject | Cu-CNT composite | en_US |
| dc.subject | MCNT composite | en_US |
| dc.subject | ECE | en_US |
| dc.subject | PH2254 | en_US |
| dc.subject | Ph.D | en_US |
| dc.title | Electrical and electrothermal performance modeling and analysis of carbon-based nanoscale interconnects | en_US |
| dc.type | Thesis | en_US |
Files
License bundle
1 - 1 of 1
No Thumbnail Available
- Name:
- license.txt
- Size:
- 1.71 KB
- Format:
- Item-specific license agreed upon to submission
- Description: